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Micron Launches Space-Qualified Portfolio to Power Mission-Critical Data for Aerospace Innovation

BOISE, Idaho, July 22, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), the only-U.S. based memory manufacturer, announced today that it is launching the industry’s highest-density, radiation-tolerant single-layer cell (SLC) NAND product. With a die capacity of 256 gigabits (Gb), this product is the first in a portfolio that will include space-qualified NAND, NOR and DRAM solutions. The product is available now and represents the first in its class to be offered by any major memory manufacturer.

The space economy is skyrocketing, fueled by rapid growth in commercial and government missions. As computing and AI evolve, demand is rising for high-performance technology capable of processing data directly in orbit. AI-enabled edge computing is transforming space operations: allowing spacecraft to analyze sensor data, detect anomalies and make decisions autonomously, reducing reliance on Earth-based systems and preserving bandwidth.

“Micron’s radiation-tolerant memory is essential for storing and processing data as we push the boundaries of computing in space,” said Kris Baxter, corporate vice president and general manager of Micron’s Automotive and Embedded Business Unit. “As AI expands in space operations — from autonomous navigation to real-time analysis — Micron is increasing our focus on delivering solutions that enable the resilience and intelligence needed for next-gen aerospace missions.”