Advanced Chip and Circuit Materials Introduces CeleritasSF & CeleritasBU Products for Ultra-High-Speed, Buildup, and UHDI Printed Circuit Boards
Advanced Chip and Circuit Materials Inc. (ACCM), a US-based manufacturer of skew free, ultra-thin copper-clad laminates and dielectric prepreg materials used to fabricate high layer count PTH, Buildup and UHDI multilayer printed circuit boards (PCBs), today announced the introduction of the CeleritasSF and CeleritasBU series of laminates and prepregs, which enable PCIe Gen 6 & 7 and data rates of 224 Gb/s per channel.
