ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet ArchitecturesERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally critical process steps. The first unit has been delivered to a leading semiconductor manufacturer for integration into its panel production line.
