YES Receives Multiple VeroTherm™ and VeroFlex™ System Orders from Leading Memory Supplier
Yield Engineering Systems (YES), a leading provider of process equipment for advanced packaging for AI and HPC systems, today announced that it has received multiple orders of VeroTherm™ and VeroFlex™ reflow systems from one of the largest memory suppliers. These systems will enable 3D stacking of memory and logic chips for high-performance AI accelerators, driven by large language model (LLM) applications.
YES Receives Orders for Multiple VertaCure™ G3 Systems From Asia’s Leading Foundry
Yield Engineering Systems (YES), a leading provider of process equipment for AI and HPC semiconductor applications, today announced orders of multiple VertaCure™ G3 curing systems from one of Asia’s top foundries. These systems will support advanced packaging processes for AI and HPC solutions, delivering critical low-temperature curing, annealing, and degassing.
YES Delivers Multiple VertaCure LX Systems
Yield Engineering Systems (YES), a leading provider of process equipment for AI and HPC semiconductor applications, today announced the delivery of multiple VertaCure™ LX curing systems to one of Taiwan’s top outsourced semiconductor assembly and test (OSAT) providers. These systems will support advanced packaging processes for Edge Computing and HPC solutions, delivering critical low-temperature curing, annealing, and degassing for WLCSP, Plated Bump, and Cu Pillar applications.
